Silicon Interposer & Silicon Bridge – Built for Advanced Packaging
We provide silicon-based Interposer and Silicon Bridge packaging solutions that support multi-chip integration and high-density interconnects.
Interposer & Silicon Bridge Solutions
|
Parameter |
Specification |
|
Products |
➢ Si Interposer ➢ Si Bridge ➢ Si capacitor |
|
Cap. Integration |
➢ Decoupling：2000 nF/mm^2 ➢ RF：5 nF/mm^2 |
|
Interconnection |
➢ fangzhen5 Cu + 1 AL ➢ bump pitch < 40μm ➢ TSV pitch < 50μm |
|
Design and Simulation |
➢ 3D HFSS/EM ➢ Thermal stress ➢ Power integrity ➢ Signal integrity ➢ Power network ➢ Standard HBM3、UCIe2.0 ➢ DFT design and reliability |
Key Features
· Low RF loss, high thermal conductivity.
· High-density routing supports multi-chip integration.
· Enables vertical interconnects and power delivery.
· Supports signal, power, and ground layer design.
· Compatible with various soldering and bonding processes.
· High-density interconnect, low latency, high signal integrity, customizable design.
Interposer & Silicon Bridge – Silicon Interposer and Silicon Bridge
Packaging Solutions
We provide silicon-based Interposer and Silicon Bridge packaging solutions
that support multi-chip integration and high-density interconnects. Through
Through-Silicon Vias (TSV) and micro-bump technologies, these solutions enable
high-frequency, low-loss signal transmission and power distribution. They are
applicable in advanced packaging, Chiplet design, high-frequency optical
modules, and high-performance computing, offering customers customized, highly
integrated system-level packaging support.
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