UV laser marking machine(MZ-3UV/MZ-5UV/MZ-10UV/MZ-15UV)

1. Equipment Features

The reaction mechanism during laser processing is achieved through
photochemical ablation, which relies on laser energy to break the bonds between
atoms or molecules, causing them to vaporize or evaporate into small molecules.
UV laser marking is characterized by a small focused spot and a wide range of
applicable materials, primarily targeting the high-end market for precision
processing.

– Excellent beam quality, smaller focused spot, minimal thermal impact, and
delicate marking;

– Most plastic materials can absorb UV laser, compensating for the
insufficient processing capabilities of other lasers;

– High marking speed and efficiency;

2.EquipmentAppearance(Reference)

1) Overall Dimensions: Length 650mm * Width 800mm * Height 1500mm (subject to
actual external dimensions)

2) Chiller Dimensions: Length 580mm * Width 290mm * Height 470mm (subject to
actual external dimensions)

3) Total Weight: 120KG (subject to actual weight)

3. Technical Parameters

4. Hardware Configuration

5. Sample Images

Plastic Logo Marking	Precision Exterior Part Marking	Charger Marking
Plastic Shell Marking	3C Product Marking	Computer Keyboard Marking

Samples Subject to Actual Results

6. Working Environment Requirements

1) Ambient temperature should be between 0-35°C, and air conditioning is
required;

2) Humidity should be between 45%-75%. No condensation is allowed, and a
dehumidifier should be installed;

3) Power supply requirements: 220V, 50Hz;

4) Power grid fluctuation: ±5%, and the grounding wire must comply with
international standards. In areas with voltage amplitude exceeding 5%, an
electronic automatic voltage and current stabilizer should be installed;

5) There should be no strong electromagnetic signal interference near the
installation site. Avoid radio transmission stations (or relay stations) in the
surrounding area;

6) Foundation vibration amplitude: recommended to be less than 50 µm;
vibration acceleration: recommended to be less than 0.05g. Avoid having a large
number of stamping or other machine tool equipment nearby;

7) The equipment space must be smoke-free and dust-free. Avoid environments
with severe dust, such as metal polishing or grinding;

8) Strict requirements for the quality of cooling water: purified water,
deionized water, or distilled water must be used. Tap water, mineral water, or
other liquids containing high levels of metal ions or minerals are not
allowed.