Sn99Ag0.3Cu0.7 Lead-Free Solder Paste

Sn99Ag0.3Cu0.7 Lead-Free Solder Paste

Product Model: Sn99Ag0.3Cu0.7

Melting Point: 217–227℃

Solder Paste Viscosity: 170±30 Pa·s

Powder Particle Size: 20–38 μm

Product Composition: Sn 99.0% + Ag 0.3% + Cu 0.7%

Storage Requirements: Store under refrigerated conditions at 2–10℃. Before use, allow the solder paste to return to room temperature for 2–4 hours to prevent condensation caused by temperature differences.

Country/Region of Origin: Ningbo, China

Environmental Certifications: RoHS, REACH

Product Applications

Sn99Ag0.3Cu0.7 Lead-Free Solder Paste is widely applied in Surface Mount Technology (SMT) processes within the electronics manufacturing industry. It is suitable for PCB assembly and soldering applications that require lead-free solutions with cost efficiency.

Typical applications include:

• Consumer electronics such as mobile phones, tablets, and wearable devices

• LED lighting products

• Power modules

• Solar panel electronics

• Automotive electronics, especially non-high-reliability core components

This solder paste is an ideal choice for manufacturers seeking reliable lead-free soldering performance while maintaining production cost advantages.

Product Features

• Lead-Free and Halogen-Free Formula: Designed to meet modern environmental requirements and comply with RoHS and REACH standards.

• Excellent Wettability and Solder Spreadability: Contains high-activity flux to improve solder flow, ensuring complete coverage and reliable solder connections.

• Low Residue and No-Clean Capability: Produces minimal post-soldering residues with non-corrosive characteristics, high insulation resistance, and supports no-clean production processes.

• Stable Solder Joint Quality: Creates bright, full solder joints with strong mechanical performance and reliable electrical connections.

• Good Anti-Collapse Performance: Effectively reduces solder bridging, cold solder joints, and other common SMT defects.

• Cost-Effective Alternative to SAC305: Maintains lead-free compliance while offering a more economical solution compared with traditional SAC305 solder paste.

Sn99Ag0.3Cu0.7 Lead-Free Solder Paste combines stable printing performance, excellent solderability, and cost advantages, making it a practical choice for large-scale SMT manufacturing applications requiring reliable and efficient lead-free soldering solutions.