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Lead-Free High-Temperature Solder Bar

Bright liquid surface during high-temperature operation in the solder furnace, no need to scrape dross from the solder surface for each operation.

Lead-Free High-Temperature Solder Bar

Bright liquid surface during high-temperature operation in the solder furnace, no need to scrape dross from the solder surface for each operation. Excellent workability and high production efficiency to increase output. Components are easy to tin, and no dross adheres to the base plate. 

SN99.3Cu0.7 Lead-Free High-Temperature Solder Bar

Product Model: SN99.3Cu0.7

Melting Point: 225-229℃

Operating Temperature: 380-500℃

Length: 300mm

Packaging Specification: 20kg/carton

Country/Region of Origin: China/Ningbo

Environmental Certifications: RoHS, REACH

Product Applications: Suitable for wave soldering, hot dip soldering, and
tinning of electronic components with enameled wire (such as transformers,
inductors, coils, relays, degaussing coils, etc.).

Product Features: Bright liquid surface during high-temperature operation in
the solder furnace, no need to scrape dross from the solder surface for each
operation. Excellent workability and high production efficiency to increase
output. Components are easy to tin, and no dross adheres to the base plate.
Tinned pins have a bright, smooth surface with good appearance. Low dross
generation reduces material costs. The product offers bright and reliable solder
joints, good wettability, minimal dross, and excellent powdering property.

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