HDI PCB with Microvias for High-Density Compact Electronics
HDI PCBs with microvias are designed for ultra-high circuit density and compact layouts.
HDI PCB with Microvias – Compact and High-Density Solutions
Introduction
Our HDI PCBs with microvias are designed to achieve ultra-high circuit density for compact electronic devices. Microvias enable precise multi-layer connections with minimal board area, supporting miniaturized and lightweight electronics. These PCBs offer excellent electrical performance, high signal integrity, and reliable operation in demanding applications.
Key Features
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Ultra-high-density circuit design for miniaturized devices
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Microvia technology for precise layer-to-layer connections
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Excellent signal integrity and low EMI
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Reliable and stable electrical performance
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Supports compact, lightweight, and portable electronics
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Customizable copper thickness, board size, and surface finish
Specifications
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Base Material: FR-4, High TG options
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Board Thickness: 0.4–1.6 mm
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Copper Thickness: 1/2 oz, 1 oz, 2 oz
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Min. Line/Spacing: 0.08 mm / 0.08 mm
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Min. Hole Size: 0.1 mm
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Via Type: Microvias
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Surface Finish: ENIG, OSP, Lead-free HASL
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Flexibility: Rigid or flexible PCB
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Applications: High-density electronics, compact devices
Packing & Delivery
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Each PCB packed in anti-static bag
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Protected with bubble wrap or foam
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Carton box with fragile label
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Quantity per carton as requested
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Label shows part number and lot
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Ship by air, sea, or courier
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Store dry, avoid sunlight and humidity
Why Choose Our HDI PCB
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Advanced microvia technology for ultra-compact boards
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High precision and reliable signal performance
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Suitable for miniaturized and portable electronics
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Supports prototype to mass production volumes
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Professional support for global electronic clients
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